DITEC
Polishing Compound - Fine Cut - 32oz
- Manufacturer part #
- PC-CMPD-FCO2
- UPC
- 850019168440
- Condition
- New
$84.00
Estimated to ship by Monday, October 19.
Product details
Polishing Compound - Fine Cut - 32oz
This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it's safe for all paint types - fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.
Features:
- Effectively removes holograms
- Free of solvents and silicone
- Appearance: Cream/Paste
- Solubility: N/A
- pH: 8
Use & Application:
For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.
Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.
Shipping weight: 2.35 lb · Package dimensions: 10 × 3 × 3 in